Press Releases of InfraTec

Modern electronic circuit boards and electronic components enable ever-increasing data transfer volumes and faster processing speeds. As a result, power consumption and heat generation often increase, which frequently leads to warping of the mounting board. In addition, many electronic devices using these components are exposed to changing environmental conditions, which can cause connection failures due to deformation of the mounting board and similar effects. Researchers at ESPEC CORP., Japan, have developed a combined method of 3D digital image measurement (DIC) and thermography to measure thermal stress-induced deformation of components as early as the design phase.

At the end of 2025, TÜV Rheinland auditors were frequently present at the Dresden headquarters of InfraTec GmbH Infrarotsensorik und Messtechnik: On the one hand, the three-year recertification according to ISO 9001 was due. The globally recognized standard defines how a quality management system (QMS) can be established, implemented, maintained, and continuously improved. On the other hand, the company sought certification of its environmental management system according to ISO 14001 for the first time – with success!

In our free of charge InfraTec online event „Micro-Thermography – Contactless Temperature Measurement in the Micrometer Scale“, you will learn everything you need to know about the basics and possibilities of micro-thermography. Our experts will provide practical tips on how to use this method efficiently to address your specific challenges.

For more than ten years, InfraTec has been offering infrared cameras with motorized zoom, which can perform thermography on objects even over long distances. By using a so-called teleextender, which is now also available for ImageIR® 6300 Z, the range of the cameras can be increased by about 1.5 times. The minimum working distance required between the camera and the test object (minimum focusing distance) increases only slightly, which is particularly advantageous.

Our free of charge InfraTec online event "Thermographic Analysis of Mechanical Processes" offers you insights in using thermography for process control and for researching friction processes.