Infrared Lock-in Ther­mo­graphy for Inspec­tion of Elec­tro­nics and Inte­grated Circuits

The inspection of electronic components and assemblies by using active thermography is an established method for troubleshooting and quality assurance – from prototype development to series production.

In particular the lock-in thermography provides highly detailed information during each development step. This information can be essential for the design of complex electronic circuits or assemblies to optimise the thermal management. Active thermography is applied especially in electronics production as a versatile tool: for example, in quality assurance, for permanent monitoring of technological parameters as well as for inline inspection of products in manufacturing.

A Glimpse at the Online Event

• Failure analysis and defect inspection

• Quality and process control

• Flexible R&D solution

• Basic configuration to turnkey solution

• Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules

• Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors